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Technical University of Munich
Technical University of Munich

M.Sc. Simon Thomann


Picture of Simon Thomann

Bio

Simon Thomann (M'22) earned his degrees in Computer Science, Master in 2022 as well as Bachelor in 2019, at Karlsruhe Institute of Technology (KIT), Germany. He started his Ph.D. at the University of Stuttgart in 2022 and has been continuing it since 2023 at the Chair of AI Processor Design within the Technical University of Munich (TUM). His research interests range from device physics to the system level. His special interest lies in circuit design, emerging technologies, and cross-layer reliability modeling from device to circuit level.

Teaching

Summer Semester 24:

  • Lab: Brain-inspired Computing for AI

Winter Semester 23/24:

  • Lecture: Innovative Computing for AI (Exercise)
  • Lab: Brain-inspired Computing for AI
  • Seminar: AI Processor Design

List of Publications (since 2023)

Full list: https://scholar.google.de/citations?user=BJ8tYi0AAAAJ&hl=de

2024

  • Mayahinia, Mahta; Thomann, Simon; Genssler, Paul R.; Münch, Christopher; Amrouch, Hussam; Mehdi B., Tahoori: Algorithm to Technology Co-Optimization for CiM-based Hyperdimensional Computing. Proceedings of the Conference on Design, Automation & Test in Europe (DATE), 2024 more…
  • Mayahinia, Mahta; Thomann, Simon; Genssler, Paul R.; Münch, Christopher; Amrouch, Hussam; Mehdi B., Tahoori: Algorithm to Technology Co-Optimization for CiM-based Hyperdimensional Computing. Proceedings of the Conference on Design, Automation & Test in Europe (DATE), 2024 more…

2023

  • Genssler, Paul R.; Thomann, Simon; Amrouch, Hussam: Tutorial: The Synergy of Hyperdimensional and In-memory Computing. International Conference on Hardware/Software Codesign and System Synthesis (CODES/ISSS ), 2023 more…
  • Kumar, Shubham; Chatterjee, Swetaki; Thomann, Simon; Chauhan, Yogesh Singh; Amrouch, Hussam: Cross-Layer Reliability Modeling of Dual-Port FeFET: Device-Algorithm Interaction. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 70 (7), 2023, 2891-2903 more… Full text ( DOI )
  • Kumar, Shubham; Thomann, Simon; Prakash, Om; Ni, Kai; Chauhan, Yogesh; Amrouch, Hussam: Comprehensive Modeling of Switching Behavior in BEOL FeFET for Monolithic 3-D Integration. IEEE Transactions on Electron Devices (TED) PP, 2023, 1-6 more… Full text ( DOI )
  • Liu, Liu; Kumar, Shubham; Thomann, Simon; Amrouch, Hussam; Hu, Xiaobo: Compact and High-Performance TCAM Based on Scaled Double-Gate FeFETs. Proceedings of the 60th Annual Design Automation Conference (DAC), 2023 more… Full text ( DOI )
  • Mema, Albi; Thomann, Simon; Genssler, Paul; Amrouch, Hussam: FDSOI-Based Analog Computing for Ultra-Efficient Hamming Distance Similarity Calculation. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) PP, 2023, 1-10 more… Full text ( DOI )
  • Novkin, Rodion; Thomann, Simon; Amrouch, Hussam: ML-TCAD: Perspectives and Challenges on Accelerating Transistor Modeling using ML. ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD), 2023 more… Full text ( DOI )
  • Parihar, Shivendra Singh; Thomann, Simon; Pahwa, Girish; Chauhan, Yogesh Singh; Amrouch, Hussam: 5nm FinFET Cryogenic SRAM Evaluation for Quantum Computing. 2023 Device Research Conference (DRC), 2023 more… Full text ( DOI )
  • Parihar, Shivendra; Thomann, Simon; Pahwa, Girish; Chauhan, Yogesh; Amrouch, Hussam: Cryogenic In-Memory Computing for Quantum Processors Using Commercial 5nm FinFETs. IEEE Open Journal of Circuits and Systems (OJCAS) PP, 2023, 1-1 more… Full text ( DOI )
  • Parihar, Shivendra; van Santen, Victor; Thomann, Simon; Pahwa, Girish; Chauhan, Yogesh; Amrouch, Hussam: Cryogenic CMOS for Quantum Processing: 5-nm FinFET-Based SRAM Arrays at 10 K. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) PP, 2023, 1-14 more… Full text ( DOI )
  • Thapar, Dhruv; Thomann, Simon; Arjun, Chaudhuri; Amrouch, Hussam; Chakrabarty, Krishnendu: Analysis and Characterization of Defects in FeFETs. IEEE International Test Conference (ITC), 2023 more…
  • Thomann, Simon; Amrouch, Hussam: FeFET Reliability Modeling for In-Memory Computing: Challenges, Perspective, and Emerging Trends. IEEE Transactions on Electron Devices (TED) PP, 2023, 1-7 more… Full text ( DOI )
  • Thomann, Simon; Genssler, Paul R.; Amrouch, Hussam: HW/SW Co-Design for Reliable TCAM- Based In-Memory Brain-Inspired Hyperdimensional Computing. IEEE Transactions on Computers (TC) 72 (8), 2023, 2404–2417 more… Full text ( DOI )
  • Thomann, Simon; Mema, Albi; Ni, Kai; Amrouch, Hussam: Reliable FeFET-based Neuromorphic Computing through Joint Modeling of Cycle-to-Cycle Variability, Device-to-Device Variability, and Domain Stochasticity. 2023 IEEE International Reliability Physics Symposium (IRPS), 2023 more… Full text ( DOI )
  • Thomann, Simon; Novkin, Rodion; Li, Jiajie; Hu, Yuting; Xiong, Jinjun; Amrouch, Hussam: Accelerating FeFET Reliability Analysis using Machine Learning. IEEE Transactions on Electron Devices (TED), 2023 more… Full text ( DOI )
  • de Abreu, Brunno Alves; Mema, Albi; Thomann, Simon; Paim, Guilherme; Flores, Paulo; Bampi, Sergio; Amrouch, Hussam: Compact CMOS-Compatible Majority Gate Using Body Biasing in FDSOI Technology. IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) 13 (1), 2023, 86-95 more… Full text ( DOI )
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